HSC126 Ion Beam Precision Grinding and Polishing System

Key Features:
• Precision Ion Beam Grinding and Polishing: Provides uniform, low-damage surface modification for metals, ceramics, semiconductors, polymers, and biological samples.
• Low-Temperature Processing Capability: Supports cryogenic operation to protect sensitive samples from thermal or beam-induced damage.
• High Stability and Automation: Features controlled beam rastering, process monitoring, and repeatable operation for consistent results.
• Damage-Free Cross-Section Preparation: Ideal for creating flat, smooth surfaces without introducing mechanical stress or contamination.
• Integration with EM Workflows: Can be seamlessly combined with cryo-transfer systems or other ion beam instruments for complete high-fidelity sample preparation.

Typical Applications:
• Materials Science: Polishing and thinning of metals, ceramics, composites, and nanostructured materials for microstructural analysis.
• Semiconductor and Microelectronics: Preparation of device cross-sections, FinFET structures, and advanced packaging inspection.
• Life Sciences: Cryo-polishing and preparation of biological samples (cells, tissues, viruses) for TEM/SEM analysis.
• Energy Materials: Examination of battery electrodes, solid electrolyte interfaces, and catalytic materials.

Q: How long will it take to receive a reply after placing the inquiry?

We attach great importance to every inquiry. On working days, we will respond within 12 hours after receiving the inquiry. 

Q: What products do you mainly offer?

We focus on the research and development as well as the supply of laboratory equipment and safety compliance testing instruments.

Q: In which fields is this product mainly applied?

Our products are widely applied in various fields, mainly including the electronics industry, the medical industry, the automotive industry, semiconductors, the research field, the optoelectronic industry, and the new energy sector.