HSC121 Ion Beam Etching and Thin Film Deposition System

Key Features:
• Precision Ion Beam Etching: Achieves uniform, low-damage surface modification, ideal for cross-sectioning, polishing, and thinning of hard and soft materials.
• Thin Film Deposition: Supports high-purity coating with metals or functional materials, ensuring uniform coverage and minimal contamination.
• Cryogenic and Ambient Operation: Compatible with low-temperature sample protection, preventing structural damage in sensitive materials.
• High Stability and Control: Offers fine beam control, automated rastering, and process monitoring for reproducible results.
• Integration Capabilities: Can be combined with cryo-transfer systems (e.g., LSCT series) for seamless workflow from sample preparation to electron microscopy.

Typical Applications:
• Materials Science: Surface and interface analysis, cross-sectional preparation of metals, ceramics, and composites.
• Semiconductor and Microelectronics: Chip failure analysis, FinFET cross-sectioning, and advanced packaging inspection.
• Life Sciences and Nanotechnology: Cryo-thinning of biological samples, preparation of nanoparticles, and delicate soft matter.
• Energy Materials: Examination of battery electrodes, fuel cell catalysts, and solid electrolyte interfaces.

Q: How long will it take to receive a reply after placing the inquiry?

We attach great importance to every inquiry. On working days, we will respond within 12 hours after receiving the inquiry. 

Q: What products do you mainly offer?

We focus on the research and development as well as the supply of laboratory equipment and safety compliance testing instruments.

Q: In which fields is this product mainly applied?

Our products are widely applied in various fields, mainly including the electronics industry, the medical industry, the automotive industry, semiconductors, the research field, the optoelectronic industry, and the new energy sector.