Key Advantages
• Multi-beam configuration: Enables simultaneous or sequential ion beam etching and ion beam deposition, improving process efficiency and flexibility.
• High surface processing precision: Supports nanoscale control over surface roughness, film density, and interface quality.
• Process adaptability: Suitable for a wide range of materials, including metals, semiconductors, ceramics, and optical coatings.
Product Features
• Independent ion beam control: Each ion source can be adjusted independently, allowing fine tuning of beam energy, current, and incident angle.
• Vacuum-based thin film processing: Operates under high-vacuum conditions to ensure clean deposition and contamination-free surface modification.
• In situ process monitoring support: Compatible with monitoring and feedback modules for improved process stability and reproducibility.
Typical Applications
• Ion beam surface modification for functional and structural materials
• Thin film engineering for optical, electronic, and protective coatings
• Precision ion beam polishing and etching for micro- and nano-scale structures